E&R Engineering Targets Advanced Packaging at SEMICON Taiwan 2026

The company’s new five-axis laser drilling solution targets high-density Fiber Array Units, supporting bandwidths up to 12.8 Tbps. By utilizing precision positioning, the system achieves drilling accuracy within ±0.5 μm, accommodating complex hole geometries required for modern optical interconnects. This development arrives as the industry pivots toward glass substrates to handle the thermal and density demands of high-performance computing.

E&R is also addressing the transition to glass-based substrates through its specialized laser and plasma units. The PHB-600A system handles large-format glass panels, while the R-300R Hybrid Plasma System employs a dual-source approach, combining microwave and radio-frequency power. This configuration allows for granular control over surface activation, deep silicon etching, and cleaning processes. These tools, which will be demonstrated at booth M1048 from September 2 to 4, aim to streamline the transition from research-level validation to full-scale production in advanced packaging environments.